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(R)
P0102BL
0.25A SCRs
SENSITIVE
MAIN FEATURES:
Symbol IT(RMS) VDRM/VRRM IGT Value 0.25 200 200 Unit A V A
A
G
A
K
G
DESCRIPTION Thanks to highly sensitive triggering levels, the PO102BL SCR is suitable for all applications where the available gate current is limited such as stand-by mode power supplies, smoke and alarm detectors... Available in SOT-23, it provides optimized space saving on high density printed circuit boards.
SOT-23
K
ABSOLUTE RATINGS (limiting values)
Symbol IT(RMS) IT(AV) ITSM Parameter RMS on-state current (180 conduction angle) Average on-state current (180 conduction angle) Non repetitive surge peak on-state current It Value for fusing Critical rate of rise of on-state current IG = 2 x IGT , tr 100ns Peak gate current Average gate power dissipation Storage junction temperature range Operating junction temperature range tp = 8.3 ms Tj = 25C tp = 10 ms tp = 10 ms F = 60 Hz tp = 20 s Tj = 25C Tj = 125C Tj = 125C Tj = 125C 6 0.18 50 0.5 0.02 - 40 to + 150 - 40 to + 125 A2S A/s A W C Tamb = 30C Tamb = 30C Value 0.25 0.17 7 Unit A A A
I t dI/dt IGM PG(AV) Tstg Tj
September 2000 - Ed: 3
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P0102BL
ELECTRICAL CHARACTERISTICS (Tj = 25C, unless otherwise specified)
Symbol IGT VGT VGD VRG IH IL dV/dt VTM Vt0 Rd IDRM IRRM VD = 12 V VD = VDRM IRG = 10 A IT = 50 mA IG = 1 mA ITM = 0.4 A RGK = 1k RGK = 1k RGK = 1k Tj = 125C Tj = 25C Tj = 125C Tj = 125C Tj = 25C Tj = 125C MAX. tp = 380 s RL = 140 RL = 3.3 k RGK = 1 k Tj = 125C Test Conditions MAX. MAX. MIN. MIN. MAX. MAX. MIN. MAX. MAX. MAX. P0102BL 200 0.8 0.1 8 6 7 200 1.7 1.0 1000 1 100 A Unit A V V V mA mA V/s V V m
VD = 67 % VDRM
Threshold voltage Dynamic resistance VDRM = VRRM
THERMAL RESISTANCES
Symbol Rth(j-a) Parameter Junction to ambient (mounted on FR4 with recommended pad layout) Value 400 Unit C/W
PRODUCT SELECTOR
Part Number P0102BL Voltage 200 V Sensitivity 200 A Package SOT-23
ORDERING INFORMATION
P 01 02 B L
SENSITIVE SCR SERIES CURRENT: 0.25A SENSITIVITY: 02: 200A VOLTAGE: B: 200V
Blank
5AA4
PACKING MODE: Tape & Reel
PACKAGE: L: SOT-23
OTHER INFORMATION
Part Number P0102BL Marking P2B Weight 0.01 g Base quantity 3000 Packing mode Tape & reel
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P0102BL
Fig. 1: Maximum average power dissipation versus average on-state current.
P(W)
0.30 0.28 = 180 0.26 0.24 0.22 0.20 0.18 0.16 0.14 0.12 0.10 360 0.08 0.06 0.04 0.02 IT(av)(A) 0.00 0.00 0.02 0.04 0.06 0.08 0.10 0.12 0.14 0.16 0.18
Fig. 2: Average and D.C. on-state current versus ambient temperature.
IT(av)(A) 0.30 0.25 0.20 0.15 0.10 0.05 Tamb(C) 0.00 0 25 50 75 100 125
= 180 D.C
Fig. 3: Relative variation of thermal impedance junction to ambient versus pulse duration.
Fig. 4: Relative variation of gate trigger current, holding current and latching current versus junction temperature (typical values).
IGT, IH, IL[Tj] / IGT , IH, IL[Tj = 25 C] 6 5 4
K=[Zth(j-a)/Rth(j-a)] 1.00
0.10
3 2 1 tp(s)
IGT
IH & IL (Rgk = 1k )
Tj(C) -20 0 20 40 60 80 100 120 140
0.01 1E-2
1E-1
1E+0
1E+1
1E+2
0 -40
Fig. 5: Relative variation of holding current versus gate-cathode resistance (typical values).
IH[Rgk] / IH[Rgk = 1k]
20 18 16 14 12 10 8 6 4 2 0 1E-2
Fig. 6: Relative variation of dV/dt immunity versus gate-cathode resistance (typical values).
dV/dt[Rgk] / dV/dt[Rgk = 1k]
10.0
1.0
Rgk(k)
1E-1 1E+0 1E+1 0.1 0 0.2 0.4 0.6 0.8
Rgk(k)
1.0 1.2 1.4 1.6 1.8 2.0
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Fig. 7: Relative variation of dV/dt immunity versus gate-cathode capacitance (typical values).
dV/dt[Cgk] / dV/dt [Rgk = 1k ]
VD = 0.67 x VDRM Tj = 125C Rgk = 1k
Fig. 8: Surge peak on-state current versus number of cycles.
10 8 6 4 2
7 6 5 4 3 2 1
ITSM(A)
Number of cycles
10 100 1000
Cgk(nF) 0 0 1 2 3 4 5 6 7
0 1
Fig. 9: Non-repetitive surge peak on-state current for a sinusoidal pulse with width tp < 10ms, and corresponding value of It.
ITSM(A),I 2t(A2s) 100.0
ITSM Tj initial = 25 C
Fig. 10: On-state characteristics (maximum values).
ITM(A) 1E+1
Tj max.: Vto = 1.00 V Rd = 1
10.0
1E+0
Tj = Tj max.
Tj = 25C
1.0 tp(ms) 0.1 0.01 0.10 1.00
I2t
1E-1 VTM(V) 1E-2 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
10.00
Fig. 11: Thermal resistance junction to ambient versus copper surface under tab (Epoxy printed circuit board FR4, copper thickness: 35 m).
Rth(j-a) (C/W) 500 400 300 200 100 S (mm 2) 0 0 10 20 30 40 50 60 70 80 90 100
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PACKAGE MECHANICAL DATA SOT-23 (Plastic)
E A
DIMENSIONS REF.
e B e1 D
Millimeters Min. Max. Min.
Inches Max.
S A1
L
H
A A1 B c D e e1 E H L S
0.89 1.4 0 0.1 0.3 0.51 0.085 0.18 2.75 3.04 0.85 1.05 1.7 2.1 1.2 1.6 2.1 2.75 0.6 typ. 0.35 0.65
0.035 0.055 0 0.004 0.012 0.02 0.003 0.007 0.108 0.12 0.033 0.041 0.067 0.083 0.047 0.063 0.083 0.108 0.024 typ. 0.014 0.026
c
FOOTPRINT DIMENSIONS (in millimeters) SOT-23 (Plastic)
0.9 0.035 0.9 0.035
2.35 0.92
1.9 0.075 1.45 0.037 mm inch
0.9 0.035
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. (c) The ST logo is a registered trademark of STMicroelectronic (c) 2000 STMicroelectronics - Printed in Italy - All Rights Reserved STMicroelectronics GROUP OF COMPANIES Australia - Brazil - China - Finland - France - Germany - Hong Kong - India - Italy - Japan - Malaysia - Malta - Morocco Singapore - Spain - Sweden - Switzerland - United Kingdom http://www.st.com
1.1 0.043
1.1 0.043
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